Mixed Adhesive Compositions Including Alpha-Cyanoacrylate Esters
Mixed Adhesive Compositions Including Alpha-Cyanoacrylate Esters
US2816093
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Abstract:
This invention relates to modified alpha-cyanoacrylates adhesive compositions and is particularly concerned with alpha-cyanoacrylate compositions containing up to 50% of a polymerizable neutral vinyl monomer admixed with monomeric alpha-cyanoacrylate ester.
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United htates Patent Office
2,8l6",0i9'3
Patented Dec. 10, 1957
1
2,816,093
MIXED ADHESIVE COMPOSITIONS INCLUDING
a-CYANOACRYLATE ESTERS
Harry W. Coover, Jr., Kingsport, Tenn., assignor to East-
man Kodak Company, Rochester, N. Y., a corporation
of New Jersey
No Drawing. Application June 2, 1954,
Serial No. 434,077
3 Claims. (Cl. 260-78.5)
This invention relates to modified ac-cyanoacrylate ad-
hesive compositions and is particularly concerned with
on-cyanoacrylate compositions containing up to 50% of a
polymerizable neutral vinyl monomer admixed with
monomeric cc-cyanoacrylate ester.
The on-cyanoacrylate esters of the formula
CH2=C|3—COOR
CN
in which R is an alkyl group of 1-16 carbon atoms, a
cyclohexyl group or a phenyl group, when applied in
monomeric form on a surface to be bonded, set up rapidly
to give a high strength adhesive bond between a great
variety of materials. This ch_aracteristic of the ac-cyano-
acrylate monomer is in contrast to the behavior of most
polymerizable monomers which cannot be used directly
for adhesive applications. One of the few types of
monomers other than the ca-cyanoacrylate esters, which
has been used for forming adhesive bonds, is the meth-
acrylate ester type monomer. These materials, however,
suffer the disadvantage that the adhesive sets up only
after a prolonged period of time, whereby the article
being bonded must be clamped or otherwise held in po-
sition for a prolonged period of time before the bond
has set sufliciently to maintain the elements in position.
This is a serious disadvantage in attempting to employ
such materials in production operations since it entails
an undesirably large expenditure for clamping means and
also requires space in which to allow the articles being
bonded to set up.
It is accordingly an object of this invention to provide
a new and improved class of mixed monomer adhesive
compositions consisting predominantly of ac-cyanoacrylate
monomer together with minor amounts of another poly-
merizable monomer to give adhesive compositions ca-
pable of rapidly forming adhesive bonds which require
no clamping or supporting after a few seconds or a few
minutes at most. _ ,
Another object of the invention is to provide monomer
mixtures which form high strength adhesive bonds in
a short period of time between a variety of materials,
and which thereafter continue to set up upon standing
without the necessity of further clamping or supporting.
A further object of the invention is to provide adhesive
compositions which form bonds having an exceptionally
high heat distortion temperature.
Another object of the invention is to increase the
availability of as-cyanoacrylate adhesive compositions at
lower prices by including in the composition more readily
available monomeric materials which do not adversely
affect the adhesive characteristics of the composition.
Other objects will be apparent from the description and
claims which follow.
The adhesive compositions of this invention comprise a
mixture of 50-99% by weight of monomeric a-cyano-
acrylate ester as defined above and l—50% by weight of
a polymerizable neutral ethylenic monomer other than an
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on-cyanoacrylate ester. This invention is predicated on
the unexpected discovery that neutral ethylenic monomers
can be included with cc-cyanoacrylate monomers in
amounts up to equal the amount of the at-cyanoacrylate
monomer without adversely affecting the adhesive char-
acteristics of the oucyanoacrylate monomer, despite the
fact that many of such neutral ethylenic monomers are
themselves of little or no use as adhesives. In the pre-
ferred embodiment of the invention, the neutral ethylenic
monomer includes from about 1 to about 15% by weight
based on the total monomer weight of a monomer such
as allylmethacrylate or divinylbenzene, whereby a com-
position having an exceptionally high heat distortion tem-
perature in the adhesive bonds is obtained. The ad-
hesive compositions of this invention can be applied di-
rectly to the surface to be bonded and begin to set up
almost immediately without the use of either heat or
pressure. Within a very short time, the bond is suf-
ficiently strong to permit the article to be moved and
further clamping or supporting is not required. The
article can thus be set aside to allow the bonding action
to be completed. This is in contrast to the bonding prac-
tice in the past using partially polymerized ethyl meth-
acrylate where the partially polymerized acrylate ester
was applied and then subjected to a heating or curing
operation to complete the polymerization and bond
formation.
The on-cyanoacrylate monomers employed in practicing
this invention can be prepared in any desired manner.
They are usually prepared by reacting a suitable oc-cyano-
acetate ester or mixture of oz-cyanoacetate esters with
formaldehyde in the presence of a basic condensation
catalyst to form a low molecular weight on-cyanoacrylate
polymer which is thereafter depolymerized by heating
under reduced pressure in the presence of an acidic poly-
merization inhibitor. Suitable cc-cyanoacrylate monomers
and their preparation is described in the copending ap-
plication of Coover and Shearer, Serial No. 318,325,
filed November 1, 1952. A particularly advantageous
method for preparing such on-cyanoacrylate monomers in
nonaqueous medium is -described in the copending ap-
plication of Joyner and Hawkins, Serial No. 415,422,
filed March 10, 1954. Any of the on-cyanoacrylate
monomers as defined herein can be used alone or in
mixture of two or more of such monomers i11 practicing
the invention. The lower alkyl oz-cyanoacrylate esters
are preferably employed due to their rapid bonding action
and the ease of preparation of such monomers from
readily available starting materials. Thus the methyl,
ethyl, isopropyl, and butyl or isobutyl on-cyanoacrylate
esters are desirably employed, although the cyclohexyl,
phenyl, capryl, octyl or other monomeric cc-cyanoacrylate
esters can be used if desired.
The adhesive compositions of the invention include
1—50% by weight based on the total monomer Weight
of one or more polymerizable neutral ethylenic monomers
other than the oz-cyanoacrylate monomer. This neutral
monomer can be a polymerizable vinyl hydrocarbon or
a neutral ethylenic ester. The acrylate and methacrylate
esters wherein the ester group contains from 1 to 4 car-
bon atoms are preferably employed in practicing the
invention. Although the vinyl esters such as vinyl acetate,
vinyl butyrate, or the like can be successfully employed,
as well as the vinyl aryl hydrocarbon such as styrene,
divinylbenzene, the acrylonitrile and methacrylonitrile
monomers, and similar neutral monomers can also be em-
ployed. When the neutral monomer includes from about
1 to about 15 % by weight based on the total monomer
weight of a difunctional neutral monomer such as an
allyl ester of a vinylic acid or -a divinyl substituted mono-
mer, the adhesive composition undergoes a degree of
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crosslinking during the bonding action whereby an excep-
tionally high heat distortion temperature for the adhesive
bond is obtained. Thus, for example, the inclusion of
.-1—15% by weight of allylacrylate, allylmethacrylate, or
.div-inylbenzene in the adhesive composition results in
adhesive bonds having melting points higher than 200° C.
.as contrasted to a melting point of 165° C. for a methyl
cyanoacrylate homopolymer. This is particularly useful
.when>the bonded article is to be subjected to high tem-
.peratures during normal use. In practicing the invention,
such neutral monomers as methyl acrylate, ethyl acrylate,
.isopropyl acrylate, butyl acrylate, isobutyl acrylate, methyl
.methacrylate, ethyl methacrylate, butyl methacrylate, ac-
rylonitrile, methacrylonitrile, styrene, methyl styrene, vinyl
acetate, vinyl butyrate, and the like are suitable for use.
The basic monomers such as vinyl pyridine are unsuitable
for use since they produce unstable mixtures which un-
dergo rapid polymerization upon addition of the basic
monomer to the at-cyanoacrylate ester. Acidic monomers
.such as ethylenic sulfonic acid cause excessive stabiliza-
tion of the mixture against polymerization and prevent
adhesive action.
The setting up of the adhesive compositions of this
invention, and particularly the ‘further bonding following
the initial bonding is promoted by including a small
amount of a peroxy catalyst in the adhesive composition
just prior to use. Any of the well known per-catalysts
such as the peroxides, persulfates, or perborates, and the
like, can be used for promoting the complete polymeriza-
tion of the composition. The amount of catalyst can, of
course, be varied but amounts of about 0.1% by weight
are usually suitable.
The adhesive compositions of the invention are sta-
bilized against polymerization during storage by inclusion
therein of from about 0.001% to about 2% by weight of
a suitable acidic polymerization inhibitor, and desirably
from 0.001 to about 0.01% by weight based on the mono-
mer weight. This stabilizer is desirably sulfur dioxide,
'although other gaseous inhibitors having an acidic nature
such as nitric oxide, hydrogen fluoride, boron trifluoride,
and the like can be used. When the gaseous stabilizer is
included in amounts of more than 0.01%, it is sometimes
desirable to remove a portion of the stabilizer prior to
use of the adhesive composition. This is readily done
by subjecting the composition to a reduced pressure of
about 1 -mm. for a few minutes. The adhesive composi-
tions can also include from about 0.001 to about 0.01%
by weight of a neutral free radical inhibitor such as hydro-
quinone, trinitrobenzene, or t-butylcatechol in combina-
tion with the acidic inhibitor. Such added stabilizers give
a high degree of stability in bulk to the adhesive composi-
tions during storage. In the preferred range of stabilizer
concentration, the adhesive composition undergoes auto-
polymerization in a few minutes when spread in a thin
film on the surface to be bonded without the application
of heat or pressure or the use of a polymerization catalyst.
In some cases, it may be desirable to heat the article dur-
ing the bonding operation in order to speed up the bond-
ing action. In some cases, it may be desirable to further
accelerate the bonding action by the application of very
small amounts of bases such as ammonia, piperidine,
pyridine, or the like to the article prior to bonding. The
use of such basic catalysts tends to give weak bonds,
however, and it is preferred to merely moisten the sur-
face with an aliphatic alcohol such as methanol, ethanol,
isobutanol, capryl alcohol, or the like prior to application
of the adhesive composition thereto. This use of alcohol
is of particular advantage in the bonding of materials
exhibiting an acidic surface character, such as green wood
or phenolic resins, or when using adhesive compositions
containing -relatively large amounts of stabilizer which
slow the adhesive action.
The adhesive compositions can be used in the form of
amixture of ‘the monomer alone, or it can include as
much as 25% by weight of a —viscosity regulator such as
2,816,093
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polymeric ac-cyanoacrylate, polyacrylate, po1ymethacry-
late or a cellulose ester, or up to about 20% by weight of
a plasticizer such as a monofunctional aliphatic ester, a
difunctional aliphatic or aromatic ester, a phosphate ester,
a phosphonate ester, or the like. i
Although the compositions of this invention can con-
tain up to 50% by weight based on the total weight of
monomer of a neutral monomer or monomers other than
the oz-cyanoacrylate monomer or monomers, the compo-
sition begins to bond rapidly asis characteristic of o:-cy-
anoacrylate adhesive compositions containing no other
added monomer. Once the bonding action has started,
a high strength bond forms in a very short time, and the
further bonding then proceedsat room temperature until
the bond has become completely polymerized. The addi-
tional vinyl monomer does not adversely affect the
strength of the adhesive bond thereby obtained. In this
way, the available supply of ac-cyanoacrylate monomers
is greatly extended, and compositions of increased utility
are readily prepared.
The invention is illustrated by the following examples,
but it will be understood that the examples are included
for purposes of illustration and are not intended to limit
the scope of the invention unless otherwise specifically
indicated.
Example I
A mixture of 10 parts by weight of methyl acrylate
with 90 parts by weight of methyl at-cyanoacrylate, both
in monomeric form, and containing 0.1% by weight of
acetyl peroxide, was employed for bonding together a
variety of objects made of glass, metal, plastics and wood.
The methyl wcyanoacrylate polymerized rapidly to set
the pieces being bonded to the extent that the article could
be moved within aifew minutes without disturbing the
bond. During this period, the methyl acrylate remained
in monomeric form. Over a period of hours, however,
the methyl acrylate also polymerized to complete the
formation of a very strong bond. No heat was required
at any stage of the bonding operation.
Example 2
As has been described, the adhesive composition can
contain equal parts by weight of at-cyanoacrylate mono-
mer and other neutral vinylmonomers with excellent
results. Thus a mixture of 50 parts by weight of methyl
methacrylate monomer with 50 parts by weight of ethyl
cc-cyanoacrylate monomer containing 0.1% by weight of
acetyl peroxide was employed for bonding a variety of
glass, metal, plastic, and wood articles. The bond formed
rapidly, and the bonding action was completed at 35° C.
Example 3
Similar results were obtained using an adhesive com-
position comprising a mixture of 20‘ parts by weight of
ethyl acrylate and 80 parts by weight of methyl cx-cyano-
acrylate, the mixture containing 0.05% by weight of
acetyl peroxide.
Example 4
Although the use of a perovide catalyst is preferred to
promote the polymerization of the non-cyanoacrylate
monomer, such catalyst not necessary for successful
bonding. Thus the procedure set out in Example 1 was
followed using an adhesive composition comprising 10
parts by weight of methyl acrylate and 90 parts by weight
of methyl on-cyanoacrylate. No peroxide catalyst was used
in this composition. The methyl ax-cyanoacrylate poly-
merized rapidly to set the bond as before. Then, over a
period of several days, the methyl acrylate polymerized
to complete the formation of a high strength bond.
Example 5
A variety of objects were bonded using an adhesive
composition containing 5 parts by weight of allyl acrylate,
10 parts by weight of methyl acrylate, 85 parts by weight
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2,816,093
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of methyl av.-cyanoacrylate and 0.05% of acetyl peroxide.
The bond formation was very rapid, and the articles could
e moved within a few minutes. After the bonded articles
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_ad been allowed to stand at room temperature for 24
hours, the heat resistance of glass to rubber and wood to
wood bonds was tested. The bonds retained their strength
at temperatures at high as 205° C.
Example 6
Other difunctional neutral monomers act in similar
ashion to crosslink the adhesive composition during
bonding to give equally heat-resistant bonds. Thus the
procedure of Example 5 was repeated using 10 parts by
weight of divinylbenzene instead of the allyl acrylate. As
before, the adhesive bonds thereby obtained remained
strong at temperatures above 200° C.
Example 7
Although the acrylate and methacrylate esters are pre-
ferred for use as the neutral vinyl monomer because of
their ready availability, other neutral vinyl monomers can
be employed with equally good results. For example, the
procedure of Example 1 was folowed using an adhesive
composition comprising 5 parts by weight of methyl acry-
late, 5 parts by weight of styrene, 90 parts by weight
of ethyl cyanoacrylate, and 0.01% by weight of acetyl
peroxide. The bonds thereby obtained had a high de-
gree of tensile‘ strength.
Example 8
Similarly advantageous results were obtained using an
adhesive composition comprising 5 parts by weight of
crylonitrile and 95 parts by weight of isobutyl u-cyano-
acrylate. The bonding was promoted by incorporating
0.02% of acetyl peroxide into the composiiton just prior
to the bonding.
The neutral monomers which are included within the
scope of this invention are those which do not polymerize
concomitantly with the u-cyanoacrylate monomers but
which polymerize following the initial bonding. Thus the
neutral vinyl monomers are those which are normally
non-autopolymerizable, that is, which do not begin to
polymerize within a few seconds or a few minutes when
spread in a thin film. This is in contrast to mixtures of
u-cyanoacrylate monomers in which the monomers often
polymerize at diflerent rates but which begin to auto-
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polymerize almost at once. The adhesive action of the
compositions of this invention is thus a two stage process
and the compositions can be designated as two-stage ad-
hesives as contrasted to a single-stage adhesive wherein
all of the monomeric components enter into the initial
bonding action.
Thus by means of this invention adhesive compositions
are provided which have a rapid bonding action initially,
and which continue to set up after the initial bonding to
give adhesive bonds of exceptional strength between a
variety of materials. Unlike the usual polymerizable ad-
hesive compositions, no heating or curing operation is
necessary, and the articles being bonded need not be
clamped or supported during the setting up of the ad-
hesive bond.
Although the invention has been described in consider-
able detail with particular reference to certain preferred
embodiments thereof, variations and modifications can
be effected within the spirit and scope of the invention as
described hereinabove and as defined in the appended
claims.
I claim:
1. An adhesive composition comprising a mixture of
at least 50% by weight of monomeric alkyl a-cyano-
acrylate wherein the alkyl group contains 1-4 carbon
atoms, 1-15 % by weight of a member of the group con-
sisting of allyl acrylate and divinyl benzene, and 1—49%
by weight of alkyl acrylate wherein the alkyl group
contains 1-4 carbon atoms.
2. An adhesive composition comprising a monomeric
mixture of at least 50% by weight of methyl u-cyano-
acrylate, 1-15 % by weight of allyl acrylate and 1—49%
by weight of methyl acrylate.
3. An adhesive composition comprising a monomeric
mixture of at least 50% by weight of methyl a-cyano-
acrylate, 1—15% by weight of divinyl benzene and 1-49%
by weight of methyl acrylate.
References Cited in the file of this patent
UNITED STATES PATENTS
2,437,231 Mowry ______________ _.. Mar. 2, 1948
2,439,081 Dickey et al ____________ _.. Apr. 6, 1948
2,467,927 Ardis _______________ ._ Apr. 19, 1949
2,615,879 Folt et al. ____________ __ Oct. 28, 1952
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